The BondMaster 600 is a portable, field-ready ultrasonic bond tester that delivers advanced multimode flaw detection for composite and metal-to-metal structures. Designed to provide crisp, high-quality signals and intuitive operation, it combines powerful bond testing software with highly advanced digital electronics to support a wide range of inspection methods. Whether you’re inspecting honeycomb composite panels, laminate skins, repaired areas, or metal-to-metal interfaces, the BondMaster 600 helps you quickly locate, identify, and evaluate disbonds and delaminations with confidence. Available in both basic and enhanced multimode configurations, it offers flexible compatibility with proven BondMaster probes and is built to withstand demanding on-site conditions. 

KEY FEATURES

• Multimode bond testing support including pitch-catch (RF, impulse, swept), resonance, and mechanical impedance analysis (MIA) (B600M model)
• Portable, rugged design with ergonomic hand strap—ideal for field inspections in tight spaces
• Bright 5.7″ color VGA display with full-screen mode for excellent visibility and reduced eye strain
• Intuitive user interface with application-specific presets and direct-access controls
• Real-time amplitude and phase readings with up to two simultaneous measurement displays
• Frequency Tracking and spectrum view for enhanced signal analysis
• Long battery life (up to ~9 hours) and IP66-rated rugged enclosure for demanding environments
• Supports existing BondMaster POWERLINK and standard probes; adaptor cables available for other probe types
• On-board storage for up to 500 files (programs + data) with preview capability
• USB, VGA, alarm, and I/O connectivity for reporting and system integration
• Two model options: basic bond tester (B600) and full multimode tester (B600M) with additional MIA and resonance capabilities